EMI RFI Shield Plating Inc

Electroless Nickel Plating In Canada

Electroless Nickel plating Canada

Electroless Nickel Plating in Canada in accordance with MIL-C-26704, AMS-C-26074, ASTM B733, AMS 2404

Electroless Nickel –Teflon in accordance with AMS 2454

PHOSPOROUS CONTENT
Should be specified

Low Phosporous- 2%-5%

Hard deposits
Very uniform thickness
Excellent corrosion resistance in alkaline enviroments
Medium Phosporous 6%-10%

Very bright and semi-bright options
High speed deposit rate
Very stable
Used for Slurry Disposal Industries
The most common type of electroless nickel applied
High Phosporous +10%

Supperior corrosion protection
Lower porosity
Non-Magnetic
Less prone to staining
Pit free-deposits
Correct callouts for aluminum are Electroless Nickel per MIL-C-26074 Class 3 or Electroless Nickel per MIL-C-26074 Class 4 depending on whether the alloy will be affected by the higher temperature of the Class 3 bake. Other basis materials should specifcy Electroless Nickel per MIL-C-26074 Class 1, if no heat treatment is required other than the embrittlement bake for hardened steel (> Rockwell C40). If a bake to increase hardness is desired, specify Electroless Nickel per MIL-C-26074 Class 2, which specifies baking to achieve a hardness greater than 800 Knoop.

 
Specification Classification
MIL-C-26074 / AMS-C-26074
Classes (Post Heat Treatment)
1
As plated. No subsequent heat treatment. A bake for hydrogen embrittlement relief is not considered a heat treatment.
2
Heat treat to obtain required hardness. May be used on all metals not affected by heating to 500⁰F and above.
3
Aluminum alloys non-heat treatable, and beryllium alloys processed to improve adhesion of the nickel deposit.
4
Aluminum alloys, heat-treatable, processed to improve adhesion of the nickel deposit.
Grades (Thickness)
A
0.0010 inch minimum 0.0010 inch minimum
B
0.0005 inch minimum
C
0.0015 inch minimum
AMS 2404
Classes (Post Heat Treatment)
1
Except for hydrogen embrittlement relief, no post plating treatment.
2
Thermal treatment at 450⁰F (232⁰C) or above to harden the deposit.
3
Thermal treatment at 375⁰F (191⁰C) to improve adhesion for non heat-treatable aluminum alloys and beryllium alloys.
4
Thermal treatment at 250⁰F (121⁰C) to improve adhesion for heat-treatable aluminum alloys.
ASTM B733
Types (Deposit Comp.)
I
No requirement for Phosphorous
II
1 to 3 % P by weight
III
2 to 4 % P by weight
IV
5 to 9 % P by weight
V
10 and above % P by weight
Service Condition (Thickness)
SC0
0.1 micron (0.000004 inch) Minimum thickness
SC1
5 micron (0.0002 inch) Light Service
SC2
13 micron (0.0005 inch) Mild Service
SC3
25 micron (0.001 inch) Moderate Service
SC4
75 micron (0.003 inch) Severe Service
Classes (Post Heat Treatment)
1
As-deposited, no heat treatment.
2
Heat treatment at 260 to 400⁰C to produce a minimum hardness of 850 HK100.
3
Heat treatment at 180 to 200⁰C for 2 to 4 hours to improve coating adhesion on steel and to provide for hydrogen embrittlement relief.
4
Heat treatment at 120 to 130⁰C for at least 1 hour to increase adhesion of heat-treatable (age-hardened) aluminum alloys and carburized steel.
5
Heat treatment at 140 to 150⁰C for at least 1 hour to improve coating adhesion for aluminum, non age-hardened aluminum alloys, copper, copper alloys and beryllium copper.
6
Heat treatment at 300 to 320⁰C for at least 1 hour to improve coating adhesion for titanium alloys.
AMS 2454 (Electroless Nickel–Teflon)
Nickel-phosphorous-polytetrafluoroethylene (PTFE) co-deposit on metal substrates. The process yields a surface with the engineering properties of nickel and the additional lubricity of Teflon®. As with standard electroless nickel, the deposit occurs via an autocatalytic chemical reaction so that a reliable, repeatable coating of uniform thickness is generated. The appearance of the plated finish is usually dull silver-gray, and can be used as a non-reflective coating for military applications. Electroless nickel/Teflon® can be applied over a variety of substrates including stainless steel, aluminum, copper, brass and others.