Copper plating in accordance with MIL-C-14550, AMS 2418, & ASTM B734
| Specification | Classification | |
| MIL-C-14550 | Classes (Thickness) | |
| 0 | 0.00100-0.00500 inch | |
| 1 | 0.00100 inch (minimum) | |
| 2 | 0.00050 inch (minimum) | |
| 3 | 0.00020 inch (minimum) | |
| 4 | 0.00010 inch (minimum) | |
| AMS 2418 | Types | |
| 1 | Engineering plating – plating thickness shall be 0.0005 to 0.0007 inch (13 to 18 microns). Other plate thicknesses may be specified by this specification number and a suffix number designating the minimum thickness in ten thousandths of an inch (increments of 2.5 microns). Thus, AMS 2418-1 designate a thickness of 0.0001-0.0003 inch (2.5-8 microns) and AMS 2418-6 designate a thickness of 0.0006-0.0008 inch (15-20 microns). | |
| 2 | Plating for masking – plating thickness shall be nominally 0.002 inch (51 microns). | |
| ASTM B734 | Classes (Thickness) | |
| 25 | 25 microns minimum | |
| 20 | 20 microns minimum | |
| 12 | 12 microns minimum | |
| 5 | 5 microns minimum | |
| x | Thickness specified |
